CoolerCube Thermal Paste, 3g CPU Thermal Compound Paste, Heatsink Paste for All Coolers, CPU, GPU, IC Processor, Carbon Based High Performance, Thermal Interface Material : Electronics

Descripción

CoolerCube Pasta térmica, 0.11 oz de pasta compuesta térmica de CPU, pasta disipadora de calor para todos los enfriadores, CPU, GPU, procesador IC, alto rendimiento basado en carbono, material de interfaz térmica : Electrónica

[UNIQUE PERFORMANCE]: high thermal conductivity (12.8 W/mK), balance thermal resistance and viscosity can keep mushy for a long time, which enhance

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